Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely
packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of
polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible
displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films.
Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The
high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass
manufacturing.